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Printed Circuit Boards
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Details
Pattern Design
UL Certification
Thick copper foil boards
Merits of thickening copper foil (increasing height of circuits)
Optimal for high current density boards such as boards for power supply
Due to high pattern height, downsizing of PCB is possible by narrowing pattern width.
Substrates with copper thickness till 210μ(6 oz) have been certified as UL standard.
Edge through hole boards
Through holes at the edge make the following possible:
Miniaturization!
Weight saving!
Direct earth!
The board edge is not wasted.
Lead-free
A wide range of variations are supported.
OSP (water-soluble pre-flux)
Lead-free solder
Electroless gold plating (gold flash)
 
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