Back to Home
HEMMI Our Business
Business Information Case Study Environment Rent Business Slide Scale Topics Company Information
Printed Circuit Boards
Quotation Request
Pattern Design
UL Certification
Thick copper foil boards
Merits of thickening copper foil (increasing height of circuits)
Optimal for high current density boards such as boards for power supply
Due to high pattern height, downsizing of PCB is possible by narrowing pattern width.
Substrates with copper thickness till 210μ(6 oz) have been certified as UL standard.
Edge through hole boards
Through holes at the edge make the following possible:
Weight saving!
Direct earth!
The board edge is not wasted.
A wide range of variations are supported.
OSP (water-soluble pre-flux)
Lead-free solder
Electroless gold plating (gold flash)
Return to previous page
Move to top of page
Hemmi Slide Rule Co., Ltd Privacy policy Site map Enquiries